1. 领导塑封/成型工艺工程组，提高工程能力和持续改进，以满足客户对质量、产量、成本、生产率、交货期和周期时间的满意度。 2. 专注塑封及成型工艺工程 工作职责1. 领导塑封及成型工程团队，以提高制程能力 2. 带领团队进行详细技术的根本原因分析并提供对客户退回的8D报告的解决方案 3. 文件化详细操作规程，为直接操作员及主管人员使用 4. 建立和文档化FMEA，控制计划，全面控制方法（TCM），作业指导书，统计过程控制和模具/成型过程的检验方法 5. 特征化工艺过程和制定具体的行动计划，不断改进并没有表现出稳定和可接受的能力模具/成型工艺， 6. 立案调查并确定必要的纠正措施，以解决内部质量和客户事件 7. 执行工程数据分析，并提供问题解决方案 8. 具有较强的注塑模具知识，与材料工程师写作对新材料进行评估 9. 负责建立和验收新生产线 10. 协调相关方论证新产品/工艺/设备 11. 封装工艺改进项目管理 12. 发展并领导工艺工程师或技术人员 Job responsibility: 1. Lead mold and Trim & form engineering team to improve process capability. 2. Lead team to analyze the detail technical root cause and provide solution for 8D report on customer return. 3. Lead team on analyze the detail technical root cause and provide solution for internal quality issue. 4. Document detailed operation process specifications for interpretation and use by direct labor operations and their supervisors. 5. Establish and document Process FMEA, Control Plans, Total Control Methodology (TCM), Work Instruction, techniques of mold / Trim & Form processes.statistical process controls and inspection.6. Characterize processes and developing specific action plans for continuous improvement in Mold / Trim & Form that has notacceptable capability. demonstrated the stability and acceptable capability. 7. Initiate investigation and define corrective actions deemed necessary to address internal quality and customer incidents. 8. Perform engineering data analysis and provide problem solution. 9. Have strong molding compound knowledge; work with material engineer for new material evaluation and qualification. 10. Responsible for setting up and buyoff new manufacturing lines. 11. Coordinate with relevant parties to qualify new product/process/equipment. 12. Assembly process improvement project management. 13. Develop and supervise process engineers or technicians任职资格 1. 机械工程或微电子工程专业本科以上学历 2. 5年以上半导体装配行业的工作经验，有塑封、成型工艺等相关工作经验 3. 2年以上管理工作 4. 流利的英语听力，口语，阅读和写作，英语6级或以上者优先 5. 良好的沟通技巧
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